RoHS Annex IV exemption 38: Lead in solder in one interface of large area stacked die elements with more than 500 interconnects per...
Annex IV 38 covers: Lead in solder in one interface of large area stacked die elements with more than 500 interconnects per interface which are used in X-ray detectors of computed tomography... The annex states several dates by equipment category or case; all are listed below.
- Annex
- Annex IV: Applications exempted from the restriction in Article 4(1) specific to medical devices and monitoring and control instruments
- Entry
- 38
- Section of the annex
- Others
- Expiry in the annex
- Several dates stated: 31 December 2019, 1 January 2020
- Version
- Consolidated version of 1 July 2026
- Official source
- Directive 2011/65/EU (RoHS), consolidated text
Entry (official wording)
Lead in solder in one interface of large area stacked die elements with more than 500 interconnects per interface which are used in X-ray detectors of computed tomography and X-ray systems.
Expires on 31 December 2019. May be used after that date in spare parts for CT and X-ray systems placed on the market before 1 January 2020.
Date wording in the entry
Expires on 31 December 2019. May be used after that date in spare parts for CT and X-ray systems placed on the market before 1 January 2020.
Validity and renewal
Article 5(5) of the directive: "An application for renewal of an exemption shall be made no later than 18 months before the exemption expires. The existing exemption shall remain valid until a decision on the renewal application is taken by the Commission." This site does not show whether a renewal application for this entry is pending or decided.
Article 5 of the directive sets validity periods and the renewal procedure for exemptions in Annexes III and IV. Its wording is quoted on the Sources and method page. This page repeats only what the annex says about this entry.
Neighbouring entries in Annex IV
- Annex IV 35: Mercury in cold cathode fluorescent lamps for back-lighting liquid crystal...
- Annex IV 36: Lead used in other than C-press compliant pin connector systems for...
- Annex IV 37: Lead in platinized platinum electrodes used for conductivity measurements...
- Annex IV 39: Lead in micro-channel plates (MCPs) used in equipment where at least one of...
- Annex IV 40: Lead in dielectric ceramic in capacitors for a rated voltage of less than...
- Annex IV 41: Lead as a thermal stabiliser in polyvinyl chloride (PVC) used as base...
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