RoHS Annex III exemption 15(a): Lead in solders to complete a viable electrical connection between the semiconductor die and carrier...
Annex III 15(a) covers: Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within... The annex states an expiry date of 21 July 2021, now past. Article 5(5): an exemption stays valid until a decision on a renewal application.
- Annex
- Annex III: Applications exempted from the restriction in Article 4(1)
- Entry
- 15(a)
- Expiry in the annex
- Expiry date stated in the annex: 21 July 2021 (before 5 November 2026; see the renewal note below)
- Version
- Consolidated version of 1 July 2026
- Official source
- Directive 2011/65/EU (RoHS), consolidated text
Scope (official wording)
Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit flip chip packages where at least one of the following criteria applies:
- a semiconductor technology node of 90 nm or larger;
- a single die of 300 mm2 or larger in any semiconductor technology node;
- stacked die packages with die of 300 mm2 or larger, or silicon interposers of 300 mm2 or larger.
Dates of applicability (official wording)
Applies to categories 1 to 7 and 10 and expires on 21 July 2021.
Validity and renewal
Article 5(5) of the directive: "An application for renewal of an exemption shall be made no later than 18 months before the exemption expires. The existing exemption shall remain valid until a decision on the renewal application is taken by the Commission." This site does not show whether a renewal application for this entry is pending or decided.
Article 5 of the directive sets validity periods and the renewal procedure for exemptions in Annexes III and IV. Its wording is quoted on the Sources and method page. This page repeats only what the annex says about this entry.
Neighbouring entries in Annex III
- Annex III 13(b)-(III): Cadmium and lead in glazes used for reflectance standards
- Annex III 14: Lead in solders consisting of more than two elements for the connection...
- Annex III 15: Lead in solders to complete a viable electrical connection between...
- Annex III 16: Lead in linear incandescent lamps with silicate coated tubes
- Annex III 17: Lead halide as radiant agent in high intensity discharge (HID) lamps used...
- Annex III 18(a): Lead as activator in the fluorescent powder (1 % lead by weight or less) of...
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